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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 ? 14 ? 001 2.7v to 5.5v input, 3a integrated mosfet single synchronous buck dc/dc converter BD9A300MUV general description BD9A300MUV is a synchronous buck switching regulator with built - in low o n - resistance power mosfets. it is capable of providing current up to 3a.the sllm tm control provides excellent efficiency characteristics in light - load conditions which make the product ideal for equipment and devices that demand minimal standby power consumption. the oscillating frequency is high at 1mhz using a small value of inductance. it is a current mode control dc/dc converter and features high - speed transient response. phase compensation can also be set easily. features ? synchronous single dc/dc c onverter . ? sllm tm (simple light load mode) c ontrol . ? over current pro tection . ? short c ircuit p rotection . ? thermal s hutdown p rotection . ? under voltage l ockout p rotection . ? adjustable s oft s tart f unction . ? power goo d o utput . ? vqfn016v3030 p ackage (b ackside h eat d issipation) applications ? step - down p ower s upply for dsps , fpgas, m icropro c essors, etc. ? laptop pcs/ t ablet pcs/ s ervers . ? lcd tvs . ? storage d evices (hdds/ssds) . ? printers, oa e quipment . ? entertainment d evices . ? distributed p ower s upply, s econdary p ower supply . key specification s ? i nput voltage range 2.7 v to 5.5v ? o utput voltage range 0.8v to v pvin 0.7v ? average output current 3a ( max ) ? switching frequency 1mhz(typ ) ? high -s ide mosfet o n -r esistance 60m (typ) ? low -side mosfet on -r esistance 60m (typ) ? standby c urrent 0 a ( typ ) package w(typ) x d(typ) x h(max) vqfn016v3030 3.00 mm x 3 .00mm x 1.00mm typical application circuit figure 1. application c ircuit vqfn016v3030 datashee t e n p v i n b o o t i t h b d 9 a 3 0 0 m u v p g d s w m o d e f b v i n v o u t a v i n s s p g d p g n d a g n d e n a b l e 1 0 f 0 . 1 f 1 . 5 h 2 2 f 2 r 1 r 2 r i t h c i t h c s s m o d e 0 . 1 f
2 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv pin configuration figure 2 . pin configuration pin descriptions pin no. pin n ame function 1 , 2 pvin power supply terminals for the switching regulator. these terminals supply power to the output stage of the switching regulator. connecting a 10f ceramic capacitor is recommended. 3, 4 pgnd ground terminals for the output stage of the switching regulator. 5 agnd ground terminal for the control circuit. 6 fb an inverting input node for the gm error amplifier. see page 23 for how to calculate the resistance of the output voltage setting. 7 ith an input terminal for the gm error amplifier output and the outp ut switch current comparator. connect a frequency phase compensation component to this terminal. see page 24 for how to calculate the resistance and capacitance for phase compensation. 8 mode turning this terminal signal low (0.2v or lower) forces the d evice to operate in the fixed frequency pwm mode. turning this terminal signal high (0.8v or higher) enables the sllm control and the mode is automatically switched between the sllm control and fixed frequency pwm mode. 9 ss terminal for setting the soft start time. the rise time of the output voltage can be specified by connecting a capacitor to this terminal. see page 23 for how to calculate the capacitance. 10, 11, 12 sw switch nodes. these terminals are connected to the source of the h igh - s ide mosfet and drain of the l ow - s ide mosfet. connect a bootstrap capacitor of 0.1f between these terminals and boot terminals. in addition, connect an inductor of 1.5h considering the direct current superimposition characteristic. 13 boot connect a bootstrap capac itor of 0.1f between this terminal and sw terminals. the voltage of this capacitor is the gate drive voltage of the h igh - s ide mosfet. 14 pgd $33rzhu*rrgwhuplqdodqrshqgudlqrxwsxw8vhrisxooxsuhvlvwrulvqhhghg6hhsdjh for how to specify the resistance. when the fb terminal voltage reaches within 7% of 0.8v ( t yp ), the internal nch mosfet turns off and the output turns high. 15 en turning this terminal signal l ow (0.8v or lower) forces the device to enter the shutdown mode. turning this ter minal signal h igh (2.0v or higher) enables the device. this terminal must be terminated. 16 avin supplies power to the control circuit of the switching regulator. connecting a 0.1f ceramic capacitor is recommended. - fin a backside heat dissipation pad. connecting to the internal pcb ground plane by using multiple vias provides excellent heat dissipation characteristics. (top view) p g n d 4 1 2 3 p v i n p g n d s s 9 1 2 1 1 1 0 s w 1 3 1 6 1 5 1 4 5 6 7 8 a g n d i t h m o d e s w s w b o o t p g d e n a v i n p v i n f b f i n
3 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv block diagram figure 3 . block d iagram current comparator gm amplifier c u r r e n t s e n s e / p r o t e c t + d r i v e r l o g i c f b m o d e p g d p g n d s w p v i n e n v o u t 3 8 1 5 1 6 1 1 1 4 4 2 1 6 1 0 1 2 a v i n 5 a g n d 9 1 3 b o o t s s i t h u v l o s o f t s t a r t v r e f p g o o d t s d s c p o s c s r q c l k g m a m p c u r r e n t c o m p a v i n s l o p e p v i n 7 o v p
4 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv description of blocks 1. vref the vref block ge nerates the internal reference voltage. 2. uvlo the uvlo block is for u nder v oltage lockout protection. it will shut down the ic when the vin falls to 2.45v ( t yp ) or lower. the threshold voltage has a hysteresis of 100mv ( t yp ). 3. s cp after the soft start is completed and when the feedback voltage of the output voltage has fallen below 0.4v ( t yp ) for 1msec ( t yp ), the scp stops the operation for 16msec ( t yp ) and subsequently initiates restart. 4. ovp over voltage protection function (ovp) compares fb terminal vol tage with the internal standard voltage vref. when the fb t erminal voltage exceeds 0.88v ( t yp ) it turns mosfet of output part mosfet off . after output voltage drop it returns with hysteresis . 5. t sd the tsd block is for thermal protection. the thermal protec tion circuit shuts down the device when the internal temperature of ic rises to 175 ?
5 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv a bsolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v pvin , v avin - 0.3 to + 7 v en v oltage v en - 0.3 to + 7 v mode v oltage v mode - 0.3 to + 7 v pgd v oltage v pgd - 0.3 to + 7 v voltage from gnd to boot v boot - 0.3 to + 14 v voltage from sw to boot ? v boot - 0.3 to + 7 v fb v oltage v fb - 0.3 to + 7 v ith v oltage v ith - 0.3 to + 7 v sw v oltage v sw - 0.3 to v pvin + 0.3 v allowable p ower d issipation ( note 1) pd 2.66 w operating t emperature r ange topr - 40 to 85 c storage t emperature r ange tstg - 55 to 150 c ( note 1) when mounted on a 70mm x 70mm x 1.6mm 4 - layer glass epoxy b oard (copper foil area: 70 mm x 70 mm) derate by 21.3mw when operating above 25 ?
6 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv electrical characteristics ( unless otherwise spe cified ta = 25c, vavin = vpvin = 5v, ven = 5v ) parameter symbol min typ max unit conditions avin pin s tandby supply current i stb - 0 10 a en= gnd operating supply current i cc - 350 500 a i out = 0ma no n - switching uvlo d etection v oltage v uvlo1 2.35 2.4 5 2.55 v v in f alling uvlo r elease v oltage v uvlo2 2.425 2.55 2.7 v v in r ising e nable en input high level voltage v enh 2.0 - v avin v en input low level voltage v enl agnd - 0. 8 v en i nput l ow h ysteresis v oltage v enl 100 200 300 mv en input c urrent i e n - 5 10 a en = 5v mode mode i nput h igh l evel v oltage v modeh 0.2 0.4 0.8 v mode in put c urrent i mode - 10 20 a mode= 5v reference v oltage, e rror a mplifier fb t erminal v oltage v fb 0.792 0.8 0.808 v fb in put c urrent i fb - 0 1 a fb= 0.8v ith s ink c u rrent i thsi 10 20 40 a fb= 0. 9 v ith s ource c urrent i thso 10 20 40 a fb= 0. 7 v soft s tart t im e t ss 0.5 1.0 2.0 ms with internal constant soft s tart c urren t i ss 0.9 1.8 3.6 a switching frequency switching f requency f osc 800 1000 1200 khz power good falling (fault) v oltage v pgdff 87 90 93 % fb falling v pgdff = fb/vfbx100 rising (good) v oltage v pgd r g 90 93 96 % fb rising v pgd r g = fb/vfbx100 rising (fault) v oltage v pgdrf 107 110 113 % fb rising v pgdrf = fb/vfbx100 falling (good) v oltage v pgd f g 104 107 110 % fb falling v pgd f g =fb/vfbx100 pgd output l eakage c urrent i lkpgd - 0 5 a pgd= 5v power g ood o n r esistance r pgd - 100 200 power g ood l ow l evel v oltage p gdvl - 0.1 0.2 v i pgd = 1ma switch mosfet high s ide fet on r esistance r onh - 60 120 m boot sw= 5v low s ide fet on r esistance r onl - 60 120 m high s ide o utput l eakage c urrent r ilh - 0 10 a no n - switching low s ide o utput l eakage c urrent r ill - 0 10 a no n - switching scp short circuit protection detection voltage v scp 0.28 0.4 0.52 v
7 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves figure 4. operating current vs temperature figure 5. stand - by current vs temperature figure 6. swi t chi n g frequency vs temperature figure 7. fb voltage reference vs temperature v in = 5.5v v in = 2.7v v in = 2.7v v in = 5.5v v in = 2.7v v in = 5.0v v in = 2.7v v in = 5.0v 100 200 300 400 500 600 700 800 -40 -20 0 20 40 60 80 temperature[c] icc[a] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -40 -20 0 20 40 60 80 temperature[c] istb[a] 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 -40 -20 0 20 40 60 80 temperature[ 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 -40 -20 0 20 40 60 80 temperature[
8 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance cu rves - continued figure 8. ith sink current vs temperature figure 9. ith source current vs temper ature figure 1 0. mode threshold vs temperature figure 1 1. mode input current vs temperature mode = 2.7v mode = 5.0v v in = 2.7v v in = 5.0v v in = 2.7v v in = 5.0v v in = 5.0v 0 2 4 6 8 10 12 14 16 18 20 -40 -20 0 20 40 60 80 temperature[ 10 15 20 25 30 35 40 -40 -20 0 20 40 60 80 temperature[ 10 15 20 25 30 35 40 -40 -20 0 20 40 60 80 temperature[ 0.2 0.3 0.4 0.5 0.6 0.7 0.8 -40 -20 0 20 40 60 80 temperature[
9 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves - continued figure 12. soft start time vs temperature figure 13. soft s tart t erminal c urrent vs temperature fig ure 1 4. high - side fet on - resistance vs temperature figure 1 5. low - s ide fet on - resistance vs temperature v in = 2.7v v in = 5.0v css = open v in = 2.7v v in = 5.5v v in = 2.7v v in = 5.0v v in = 3.3v v in = 2.7v v in = 5.0v v in = 3.3v 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 temperature[ 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 temperature[ 30 40 50 60 70 80 90 100 110 120 -40 -20 0 20 40 60 80 temperature[ 30 40 50 60 70 80 90 100 110 120 -40 -20 0 20 40 60 80 temperature[
10 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves - continued figure 16. pgd falling voltage vs temperature figure 17. pgd rising voltage vs temperature figure 1 8. pgd on - resistance vs temperature figure 1 9. uvlo threshold vs tempera ture release detect fault good v in = 5.0v fault good v in = 5.0v v in = 2.7v v in = 5.0v -14 -13 -12 -11 -10 -9 -8 -7 -6 -40 -20 0 20 40 60 80 temperature[ 6 7 8 9 10 11 12 13 14 -40 -20 0 20 40 60 80 temperature[ 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 temperature[ 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 -40 -20 0 20 40 60 80 temperature[
11 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves - continued figure 20. en threshold vs temperature figure 21. en input current vs temperature up down en = 5.0v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -40 -20 0 20 40 60 80 temperature[ 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 -40 -20 0 20 40 60 80 temperature[
12 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves (application) figure 22. efficiency vs load current (v in = 5v, v out = 1.8v, l= 1.5 h) figure 23. efficiency vs load current (v in = 3.3 v, v out = 1.8v, l= 1.5 h) figure 24. efficiency vs load current (v in = 5.0v, mode = 5.0v, l=1.5 h) figure 25. closed loop response (v in = 5v, v out = 1.8v, i out = 1a, l= 1.5 h, c out = ceramic 44 f) v out =3.3v v out =1.2v phase gain v in =5v v out =1.8v v out =1.8v v in =5.0v v out =1.8v mode = l mode = h v in =3.3v v out =1.8v mode = h mode = l 0 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 10 output_current (a) efficiency [%] 0 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 10 output_current [a] efficiency [%] 50 55 60 65 70 75 80 85 90 95 100 0 0.5 1 1.5 2 2.5 3 efficiency [%] output_current [a] -80 -60 -40 -20 0 20 40 60 80 1k 10k 100k 1m frequency[hz] gain[db] -180 -135 -90 -45 0 45 90 135 180 phase[deg]
13 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves (application) - continued figure 26. power up (v in = en) figure 27. power down (v in = en) figure 28. power up (en = 0v : 5 v) figure 29. power down (en= 5 v : 0v) v in = 5v/div en= 5v/div v out = 1v/div sw= 5v/div time= 1ms/div v in = 5v/div en= 5v/div v out = 1v/div sw= 5v/div time= 1ms/div v in = 5v/div en= 5v/div v out = 1v/div sw= 5v/div time= 1ms/div v in = 5v/div en= 5v/div v out = 1v/div sw= 5v/div time= 1ms/div
14 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves (application) - continued figure 30. output ripple (v in = 5v, v out = 1.8v, i out = 0a) figure 31. output ripple (v in = 5v, v out = 1.8v, i out = 3a) figure 32. input ripple (v in = 5v, v out = 1.8v, i out = 0a) figure 33. input ripple (v in = 5v, v out = 1.8v, i out = 3a) v in = 50mv/div sw= 2v/div time= 20ms/div v in = 50mv/div sw= 2v/div time= 1s/div v out = 20mv/div sw= 2v/div time= 0.5 ms/div v out = 20mv/div sw= 2v/div time= 1s/div
15 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves (application) - continued figure 34. switching waveform (v in = 3.3v, v out = 1.8v, i out = 1a, l= 1.5 h) figure 35. switching waveform (v in = 5.0v, v out = 1.8v, i out = 1a, l= 1.5 h) figure 36. sw itching waveform with sllm tm (v in = 3.3v, v out = 1.8v, i out = 30ma, l=1.5 h ) i l = 1a/div sw= 2v/div time= 1s/div i l = 1a/div sw= 2v/div time= 1s/div i l = 500ma/div sw= 2v/div time= 10s/div sllm tm control
16 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv typical performance curves (application) - continued figure 37. line regulation vs input voltage figure 38. load regulation vs load current figure 39. load transient response i out = 0.75a to 2.25a load step (v in = 5v, v out = 1.8v, c out = ceramic 44 f ) figure 40. load transient response i out =0a to 3a load step (v in = 5v, v out = 1.8v, c out = ceramic 44 f ) v out = 50mv/div time= 1ms/div i out = 1a/div v out = 50mv/div time= 1ms/div i out = 1a/div v out =1.8v v in =5.0v v out =1.8v -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0 1 2 3 output current [a] output voltage deviation [%] -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 2.5 3.0 3.5 4.0 4.5 5.0 5.5 vin input voltage[v] output voltage deviation[%]
17 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv 1. function explanations (1) dc/dc converter operation BD9A300MUV is a synchronous rectifying step - down switching regulator that achieves faster transient response by employing current mode pwm control syste m. it util izes switching operation in pwm (pulse width modulation) mode for heavi er load, while it utilizes sllm (simple light load mode) control for lighter load to improve efficiency. sw= 2v/div time= 5s/div v out = 50mv/div sw= 2v/div time= 5s/div v out = 50mv/div figure 42. sw waveform(sllm tm control) (v in = 5.0v, v out = 1.8v, i out = 50ma) figure 43. sw waveform (pwm control) (v in = 5.0v, v out = 1.8v, i ou t = 1a) q sllm tm c ontrol r pwm co ntrol figure 41. efficiency (sllm tm control and pwm control) (2) pwm control (iilflhqf\>@ output current i out [a] (1) sllm tm control
18 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv (2) enable control the i c shutdown can be controlled by the voltage applied to the en termi nal. when ven reaches 2.0v ( t yp ), the internal circuit is activated and the ic starts up. to enable shutdown control with the en terminal, the shutdown interval (low level interval of en) mu st be set to 100s or longer. figure 44. start up and down with enable (3) power good when the output voltage reaches outside 10% of the voltage setting, the open drain n - ch mosfet internally connected to the pgd terminal turns on and the p gd terminal is pulled down zlwkdqlpshgdqfhri t yp ). a hysteresis of 3% applies to resetting . connecting a pull up resistor n wrn lvuhfrpphqghg figure 45. pgd t iming c hart v out pgd - 10% - 7% +7% +10% v e n 0 v o u t 0 s o f t s t a r t 1 m s e c ( t y p ) v e n h v e n l e n t e r m i n a l o u t p u t s e t t i n g v o l t a g e t t
19 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv 2. pro tecti on the protective circuits are intended for prevention of damage caused by unexpected accidents. do not use them for continuous protective operation. (1) short circuit protection (scp) the short circuit protection block compares the fb terminal voltage with the internal reference voltage vref. when the fb terminal voltage has fallen below 0.4v( t yp ) and remained there for 1msec( t yp ), scp s tops the operation for 16msec( t yp ) and subsequently initiates a restart. en t erminal fb t erminal short c ircuit p rote ction short c ircuit p rotection o peration 2.0v or h igher < 0. 4 v( typ ) enabled on > 0. 4 v( typ ) off 0.8v or l ower - disabled off figure 46. short circuit protection (scp) t iming c hart 0 . 8 v s c p t h r e s h o l d v o l t a g e : 0 . 4 v ( t y p ) s c p d e l a y t i m e 1 m s e c ( t y p ) s c p r e l e a s e l o w o c p t h r e s h o l d 6 . 0 a ( t y p ) v o u t f b t e r m i n a l l o w e r m o s f e t g a t e u p p e r m o s f e t g a t e b u i l d - i n i c h i c c u p d e l a y s i g n a l c o i l c u r r e n t ( o u t p u t l o a d c u r r e n t ) s o f t s t a r t 1 m s e c ( t y p ) s c p r e s e t s c p d e l a y t i m e 1 m s e c ( t y p ) l o w 1 6 m s e c ( t y p )
20 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv (2) under voltage loc kout protection (uvlo) the under voltage lockout protection circuit monitors the avin terminal voltage. the operation enters standby when the avin terminal voltage is 2.45v ( t yp ) or lower. the operation starts when the avin terminal voltage is 2.55v( t yp ) or higher. figure 47. uvlo t iming c hart (3) thermal shutdown when the chip temperature exceeds tj = 175 ? ? v i n 0 v v o u t t o p m o s f e t g a t e f b t e r m i n a l s o f t s t a r t h y s u v l o o f f u v l o o n n o r m a l o p e r a t i o n n o r m a l o p e r a t i o n u v l o b o t t o m m o s f e t g a t e
21 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv application example figure 48 . application circuit table 1 . recommend ed component values reference designator output voltage description 1.1v 1.2v 1.5v 1.8v 3.3v r3 8.2 n 8.2 n 9.1 n 9.1 n 18 n - r5 100 n 100 n 100 n 100 n 100 n - r7 10 n 10 n 16 n 30 n 75 n - r8 27 n 20 n 18 n 24 n 24 n - c2 10 f 10 f 10 f 10 f 10 f 10v, x5r, 1206 c4 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 25v, x5r, 0603 c6 2700pf 2700pf 2700pf 2700pf 2700pf - c7 0.01 f 0.01 f 0.01 f 0.01 f 0. 01 f - c8 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f - c9 22 f 22 f 22 f 22 f 22 f 10v, x5r, 1210 c10 22 f 22 f 22 f 22 f 22 f 10v, x5r, 1210 l1 1.5 h 1.5 h 1.5 h 1.5 h 1.5 h toko, fdsd0630 m o d e p v i n b o o t i t h b d 9 a 3 0 0 m u v p g d s w f b v i n v o u t a v i n s s p g d p g n d a g n d e n c 2 r 3 c 6 c 8 l 1 r 8 c 1 0 c 4 c 7 r 7 r 5 e n a b l e c 9
22 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv selection of components externally connec ted 1. output lc filter constant the dc/dc converter requires an lc filter for smoothing the output voltage in order to supply a continuous current to the load. BD9A300MUV is returned to the ic and il ripple current flowing through the inductor for sllm tm c ontrol. this feedback current, inductance value is the behavior of the best when the 1.5h. therefore, the inductor to use is recommended 1.5h . figure 49. waveform of c urrent t hrough i nductor figure 50. output lc f ilter c ircuit computat ion with vin = 5v, v out = 1.8v, l=1.5h, a nd the switching frequency f osc = 1mhz, the method is as below. inductor ripple current ? il the saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ripple current ? il. the output capacitor c out affects the output ripple voltage characteristics. the output capacitor c out must satisfy the required ripple voltage characteristics. the output ripple voltage can be represented by the following equation . r esr is the equivalent series resistance (esr) of the output capacitor. with c out = 44f, resr p wkhrxwsxwulssohyrowdjhlvfdofxodwhgdv *be careful of total capacitance value, when additional capacitor c load is connected in addi tion to output capacitor c out . use maximum additional capacitor c load ( m ax) condition which satisfies the following method . maximum starting inductor ripple current i lstart can be expressed in the following method. i l t inductor satura tion current > i outmax + ? i l /2 i outmax average inductor cur rent ? i l v o u t l c o u t p v i n d r i v e r [ ] ma 768 = l f v 1 ) v (v v = i osc in out in out l - [ ] v ) f c 8 1 + (r i = v osc out esr l rpl [ ] mv 9.8 = ) 1mhz) 44 (8 1 + (10m 0.768 = v rpl 3.8a(min) limit current over < il current ripple inductor starting maximum start 2 i + ) i capacitor( output to current charge + current(i output starting maximum = il l cap ) omax start
23 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv charge current to output capacit or i cap can be expressed in the following method . computation with v in = 5v, v out = 3.3v, l = 1.5h, s witching frequency f osc = 800khz ( m in ), output capacitor c out = 44f, soft start time t ss = 0.5ms ( m in ), l oad c urrent during s oft s tart i oss = 2a the method is as below. if the value of c load is large, and can not meet the above equation, a djust the value of the capacitor c ss to meet the above formula. ( r efer to the following items (3) soft start setting equation of time t ss and soft - start value of the capacitor to be connected to the c ss .) computation with v in = 5 v, v out = 3.3v , l = 1.5 h, l oad c urrent during s oft s tart i o ss = 2a, switching frequency f osc = 800 khz ( min ), output capacitor c out = 44 f, v fb = 0.792 v( max ) , i ss = 3.6 a ( max ) , a capacitor connected to the c ss if you want to connect the c load = 22 0uf is the following equation . 2. output voltage setting the output voltage value can be set by the feedback resistance ratio. figure 51. fe edback r esistor c ircuit 3. soft start setting turning the en terminal signal h igh activates the soft start function. this causes the output voltage to rise gradually while the current at startup is placed under control. this allows the prevention of output v oltage overshoot and inrush current. the rise time depends on the value of the capacitor connected to the ss terminal. turning the en terminal signal h igh with the ss terminal open (no capacitor connected) or with the terminal signal h igh causes the output voltage to rise in 1 msec ( t yp ). >+ >) gm amp v out r1 r2 0.8v fb [ ] a ss out load out cap t v ) c + (c = i [ ] f 157.9 c - v t /2) l i - i - (3.8 < (max) c out out ss oss load out ss ss out fb l oss load c - c i v v /2) i - i - (3.8 < (max) c [ ] nf 2.97 = ) c + (c v /2) i - i - (3.8 i v > c out load fb l oss ss out ss [ ] v 0.8 r2 r2 + r1 = v out [ ] [ ] [ ] [ ] msec a f 4.44 = /1.8 0.8 (0.010 = t 0.01 = c i v c t )/i v (c = t ss ss ss fb ss ss ss fb ss ss )) (1.8a(typ
24 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv 4. phase compensation component a current mode control buck dc/dc converter is a two - pole, one - zero system. two poles are formed by an error amplifier and load and the one zero point is added by phase compe nsation. the phase compensation resistor r ith determines the crossover frequency fcrs where the total loop gain of the dc/dc converter is 0db. a high value crossover frequency fcrs provides a good load transient response characteristic but inferior stabili ty. conversely, a low value crossover frequency f crs greatly stabilizes the characteristics but the load transient respo nse characteristic is impaired. (1) selection of phase compensation resistor r ith the phase compensation resistance r ith can be determined by using the following equation. (2) selection of phase compensation capacitance c ith for stable operation of the dc/dc converter, zero for compensation cancels the phase delay due to the pole formed by the load . the phase compensation capaci tance c ith can be determined by using the following equation. (3) loop s tability to ensure the stability of the dc/dc converter, make sure that a sufficient phase margin is provided. a phase margin of at least 45o in the worst conditions is recommended. figure 52. phase c ompensation c ircuit figure 53. bode p lot >+ >) v out r up c ith ith r ith fb r dw 0 .8 v phase margin >+ 180 >+ 90 >+ 180 >+ 90 0 0 a (a) gbw(b) f f gain [db] db phase phase[deg] f crs [ ] (typ)) (260 a/v ma mp fb out crs out ma mp fb out crs out ith g g v c f v g g v c f v 2 = r [ ] f out ith out out ith i r v c = c
25 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv pcb layout design in th e buck dc/dc converter a large pulse current flows into two loops. the first loop is the one into which the current flows when the h igh - s ide fet is turned o n . the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the l ow - s ide fet is turned on. the flow starts from the l ow - s ide fet, runs through the inductor l and output capacitor c out and back to gnd of the l ow - s ide fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. it is recommende d to connect the input and output capacitors directly to the gnd plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics . accordingly, design the pcb l ayout considering the following points. ? connect an input capacitor as close as possible to the ic pvin terminal on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper foil plane for the gnd node to assist heat dissipati on from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. route the coil pattern as thick and as short as possible. ? provide lines connected to fb and ith far from the sw no des. ? place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. figure 54. current l oop o f b uck dc/dc c onverter v in gnd v out en gnd figure 55. example of evaluation board layout top layer bottom layer c out c in l c i n m o s f e t c o u t v o u t l v i n
26 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv power dissipation when designing the pcb layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. this package incorporates an exposed thermal pad. solder directly to the pcb ground plane . after soldering, the pcb can be used as a heatsink. the exposed thermal pad dimensions for this package are shown in page 3 1 . figure 5 6 . thermal d erating c haracteristics (vqfn016v3030) 0 25 50 75 100 125 150 0 2.0 3.0 4.0 [2] 1.77w [1] 2.66w allowab le power dissipation: pd [w] ambient temperature: ta [ c ] 1.0 [3] 0.62w [4] 0.27w (1) 4 - layer board (surface heat dissipation copper foil 5505 mm 2 ) ( copper foil laminated on each layer ) ? ? ? ?
27 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv i/o equivalence circuit s 6. fb 7. ith 8. mode 9. ss 10.11.12. sw1 3. boot 14. pgd 15. en a g n d f b 2 0 k 2 0 k a g n d m o d e a g n d 1 0 1 0 k 5 0 0 k a g n d s s a g n d a g n d a v i n 2 0 k 1 0 0 k 1 k 1 k b o o t p v i n p g n d p v i n s w p v i n a g n d p g d a g n d 6 0 a g n d e n a g n d a g n d 1 0 k 5 7 0 k 4 3 0 k i t h a g n d a v i n a g n d 4 0
28 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an exte rnal diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. or 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separatel y but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground vo ltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm 4 - layer glass epoxy board. in case of exceedin g this absolute maximum rating increase the board size and copper area to preve nt exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each p arameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one po wer supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic fi eld may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each p urfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precauti ons during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other espec ially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
29 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv opera tional notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
30 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv ordering informatio n b d 9 a 3 0 0 m u v - e 2 part number package vqfn016v3030 packaging and forming specification e2: e mbossed tape and reel marking diagrams vqfn016v3030 (top view) 300 part number marking lot number 1pin mark d 9 a
31 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv physical dimension, tape and reel information package name vqfn016v3030
32 / 32 tsz02201 - 0j3j0aj00350 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 30 . jun .201 7 rev.00 3 www.rohm.com tsz22111 15 001 b d 9a300muv revision history date revision changes 03.jun.2013 001 n ew 13 . sep .2013 00 2 fonts change 3 0.ju n .201 7 0 03 modif ied en electrical characteristics
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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